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Osaki Engineering Co., Ltd.
326, Sayamagahara
Phone: +81 429343411p:+81 429343411 IRUMA-SHI, STM  358-0032  Japan Fax: +81 429344701f:+81 429344701

This company is no longer actively traded on any major stock exchange.
This is a Subsidiary, click here for the Parent Company

Business Summary
OSAKI ENGINEERING CO., LTD. is a Japan-based manufacturing company. The Company has two product lines. The Flat Panel Display (FPD)-related Equipment product line provides chip on glass (COG), chip on film (COF), tape carrier package (TCP), flexible printed circuit (FPC) and printed circuit board (PCB) packaging equipment, as well as anisotropic conductive film (ACF) adhesive equipment, engineering equipment and thermocompression bonding equipment. The Semiconductor-related Equipment product line offers COF packaging equipment, slitters, capacitor adjusting equipment, communication inspection equipment, resin sealing apparatus, card collation systems, reinforcing board adhesive equipment, flip chip bonders, ball bump flatteners and camera module assemblies, among others.
(Source: ARS)

Scores and Ratings
FRISK®
Score
Z''
Score
PAYCE®
Score
DBT
Index
Moody's
Rating
Fitch
Rating
DBRS
Rating
-Yes-----

Financials, News and Filings
Latest
Statement
Last
Audit

News
SEC
Filings
Bankruptcy
Filings
Suit &
Judgment
Filings
Tax
Lien
Filings
3/31/20163/31/2016Yes----

Officers and Directors

Title

Name

Age
Title
Date
Start
Date
Honorary Chairman of the Board, Director YoshihideWatanabe 65 6/1/2007 4/1/1990
President, President of Subsidiary, Representative Director HaruoTada 60 5/1/2009 7/1/2006
Senior Managing Director, Chief Director of Business Administration ShigeakiOno 64 6/1/2013 6/1/2005
4 additional Officers and Directors records available in full report.

General Information
Stock Exchange: TYO
Fax Number: +81 429344701


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Saturday, July 22, 2023