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Kinsus Interconnect Technology Corp.
No.1245, Junghua Road, Shihlei Village
Phone: +886 34871919p:+886 34871919 TAOYUAN, 327  Taiwan Ticker: 31893189

Business Summary
Kinsus Interconnect Technology Corp is a Taiwan-based company principally engaged in the manufacture and distribution of substrates and printed circuit boards (PCBs). The main products portfolio consists of plastic ball grid array (BGA) substrates, multi-chip-module (MCM) BGA substrates, chip scale package (CSP) mini-BGA substrates, high dissipation cavity down substrates and thermal enhanced-BGA (TEBGA) substrates, flip chip substrates, flip chip CSP substrates and others. Its products are raw materials or carrier components in the packaging industry and are used as chip carriers during semiconductor assembly and as channels for external circuit connections. The Company sells products domestic and foreign integrated circuit (IC) packaging, design, and system companies. The Company distributes products in Taiwan, Mainland China, the United States, Japan, Europe, and other markets.

Scores and Ratings
FRISK®
Score
Z''
Score
PAYCE®
Score
DBT
Index
Moody's
Rating
Fitch
Rating
DBRS
Rating
YesYes-----

Financials, News and Filings
Latest
Statement
Last
Audit

News
SEC
Filings
Bankruptcy
Filings
Suit &
Judgment
Filings
Tax
Lien
Filings
3/31/202412/31/2023Yes----

Officers and Directors

Title

Name

Age
Title
Date
Start
Date
Chairman of the Board, Deputy Chief Strategy Officer Syh-JangLiao 74 5/1/2022 7/12/2021
Chief Executive Officer, General Manager, Director Ho-ShuChen 7/13/2021 9/11/2000
Chief Technology Officer, Director Qian-WeiChang 7/12/2021 9/11/2000
12 additional Officers and Directors records available in full report.

Business Names
Business Name
3189
Kinsus Interconnect Technology Corp
Kinsus Interconnect Technology Corp.

General Information
Number of Employees: 7,207 (As of 12/31/2014)
Outstanding Shares: 454,423,000 (As of 3/31/2024)
Shareholders: 54,691
Stock Exchange: TPE
Fax Number: +886 34871920


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Thursday, July 18, 2024