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Shenzhen Danbond Technology Co Ltd
Danbond Technology Building
No. 8, Langshan Yi Road
Phone: +86 75526511518p:+86 75526511518 SHENZHEN, GNG  518057  China Fax: +86 75526981518f:+86 75526981518
This company is no longer actively traded on any major stock exchange.
Business Summary
Shenzhen Danbond Technology Co., Ltd. is a China-based company, principally engaged in the research and development, manufacture and distribution of electronic components. The Company's products mainly include flexible printed circuit boards (FPCs), chip on film (COF) flexible packaging substrates, as well as COF products. The Company's products are mainly applied in electronic terminals. The Company distributes its products within domestic market and to overseas markets, with Japan as its major market.
(Source: ARS)

Scores and Ratings
FRISK®
Score		 Z''
Score		 PAYCE®
Score		 DBT
Index		 Moody's
Rating		 Fitch
Rating		 DBRS
Rating
-Yes-----

Financials, News and Filings
Latest
Statement		 Last
Audit
News		 SEC
Filings		 Bankruptcy
Filings		 Suit &
Judgment
Filings		 Tax
Lien
Filings
3/31/202212/31/2021Yes----

Industries
SIC Code Description
3672 Printed circuit boards
3674 Semiconductors and related devices
3679 Electronic components, not elsewhere classified
5093 Scrap and waste materials

Officers and Directors

Title
Name
Age		 Title
Date		 Start
Date
Chairman of the Board, Acting Finance Director PingLiu 57 4/28/2022 11/1/2001
Secretary of the Board DandanCui 36 10/27/2021 10/27/2021

General Information
Number of Employees: 370 (As of 12/31/2021)
Outstanding Shares: 547,920,000 (As of 3/31/2022)
Shareholders: 37,013
Stock Exchange: SHE
Fax Number: +86 75526981518


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Wednesday, April 3, 2024