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Signetics Corp
711, Pyeonghwa-ro, Tanhyeon-myeon
Phone: +82 319407400p:+82 319407400 PAJU, 10861  South Korea Ticker: 033170033170
Business Summary
Signetics Corp. is a Korea-based company principally engaged in the semiconductor packaging business. The Company provides laminate packages, tape packages, lead frame packages and flip chip packages for applications in the communication, consumer and computing markets. Its laminate packages include fine pitch ball grid array (FBGA), board on chip (BOC), stacked die chip scale package (CSP), plastic BGA (PBGA), heat spreader PBGA, enhanced PBGA and fine pitch land grid array (FLGA). Its tape packages include tape BGA and thin fine BGA. Its lead frame packages include metric, low-profile and thin quad flat package (QFP), thin-shrink small outline package (TSSOP), thin small-outline packages (TSOP) and quad flat no-lead (QFN). Its flip chip packages include flip chip BGA (FCBGA) and flip-chip chip scale package (FCCSP).

Scores and Ratings
FRISK®
Score		 Z''
Score		 PAYCE®
Score		 DBT
Index		 Moody's
Rating		 Fitch
Rating		 DBRS
Rating
YesYes-----

Financials, News and Filings
Latest
Statement		 Last
Audit
News		 SEC
Filings		 Bankruptcy
Filings		 Suit &
Judgment
Filings		 Tax
Lien
Filings
12/31/202312/31/2023Yes----

Industries
SIC Code Description
3674 Semiconductors and related devices

Officers and Directors

Title
Name
Age		 Title
Date		 Start
Date
Chief Executive Officer, Director Yeong HuiSong 61 3/25/2024 12/21/2020
Internal Auditor Deok SuYim 53 3/22/2013 3/22/2013
Director Se WonBahn 58
Non-Executive Independent Director Yeon HoJung 56

General Information
Number of Employees: 169 (As of 12/31/2015)
Outstanding Shares: 85,728,319 (As of 12/31/2023)
Shareholders: 21,832
Stock Exchange: KDQ
Fax Number: +82 319407887


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Wednesday, April 17, 2024